Plating technology for fine and precise sealing components (sealing components such as quartz devices)
A technology that can electroplate a large number of extremely thin and fine flat metal products (nickel and gold plating)! Comprehensive measures against contamination such as dust are also in place!
It is utilized as a plating for metal processed products that serve as "covers" to seal ceramic packages for mainly crystal devices, SAW filters, and various sensors, processing hundreds of millions of units per month. The size is small, measuring 1.47×1.07mm (0.05t). Even with large-scale processing, there is almost no "overlap" caused by plating. For press-cut products, plating treatment resolves issues such as "remaining overlap marks or incomplete coverage" and "drying stains." Additionally, contamination countermeasures are well-developed, assuming post-processing will be implemented and assembled in a clean room. 【Burr Countermeasures by Pressing】 Resolved through a unique chemical polishing treatment. 【Ensuring Solder Wetting Properties】 - Introduction of a unique plating solution management method through dedicated line processing. - If necessary, an additional treatment process to enhance wettability can be added. 【Types of Plating】 1. Nickel Plating (Ni, Ni-p) Finish Electrolytic plating: Matte Electroless plating (Ni-p: medium phosphorus type): Glossy 2. Gold Plating (Au) Finish Electrolytic plating: Matte (soft)
- Company：友電舎 本社、工場
- Price：Other
